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PCB Assembly

PCB Assembly
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Description

& quot;Flex, rigid flex, and rigid PCB form factors
SMT, through-hole, and mixed technology
Board sizes up to 18” x 14”
Complex, high density assemblies
PBGA, CBGA, TBGA, FPGA, CGA, LGA
Package on Package (PoP) assembly
Micro BGA (0.4mm)
0402s, 0201s, 01005s
Wave and selective solde
http://www.hemeixinpcb.com
& quot;

PCB Assembly , PCB Assembly ,

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PCB Design Typical high-speed board...

Hemeixin Electronics Co.,Ltd

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Address: South of 5th Floor, Building 7,Wanxia Industrial Park, Tongfuyu Industrial Area, Shajing Town, Baoan District, Shenzhen,China,
shenzhen, guangdong
China,

Tel: 86-0755-27586529
Fax: 86-0755-27934435

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