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Manufacturer of diamond wire for slicing sapphire ingot

HMT-7

Description

As the manufacturer and supplier of Diamond cutting wire. Homray Material Technology can provide multi wire saw diamond wire, Sapphire wafer slicing diamond wire.
Diamond Cutting Wire
Excellent tension control and yield strength
50% faster than conventional cutting process
High precision and good surface performance
Precise control for wire diameter, uniform wire shape

Diamond cutting wire manufacturer, Silicon wafer slicing diamond wire,

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Homray Material Technology

Double side lapping carrier, Blue steel lapping carrier, Diamond Cutting Wire, Ceramic Block, Ceramic conditional ring, Pure copper polishing plate,

Address: LiSheng Industrial Building,60 Suli Road,
Suzhou, Jiangsu
China, 215000

Tel: 0086-67084276
Fax:

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