Machinery & Equipment

Share us

Diamond cutting wire for silicon wafer manufacturer

HMT-6

Description

As the manufacturer and supplier of Diamond cutting wire. Homray Material Technology can provide multi wire saw diamond wire, Sapphire wafer slicing diamond wire.
Diamond Cutting Wire
Excellent tension control and yield strength
50% faster than conventional cutting process
High precision and good surface performance
Precise control for wire diameter, uniform wire shape

multi wire saw diamond wire manufacturer , Wire saw machine diamond cutting wire,

Read More

Previous

Diamond cutting wire for sapphire wafer manufacturer...

Previous

Manufacturer of diamond wire for slicing sapphire ingot...

Homray Material Technology

Double side lapping carrier, Blue steel lapping carrier, Diamond Cutting Wire, Ceramic Block, Ceramic conditional ring, Pure copper polishing plate,

Address: LiSheng Industrial Building,60 Suli Road,
Suzhou, Jiangsu
China, 215000

Tel: 0086-67084276
Fax:

H5响应式定制设计
26种语言,SEO营销型网站


H5/响应式/营销型企业网站; 26种语言扩展;
覆盖: 英文、法语、德语、西班牙语、葡萄牙语、俄语、阿拉伯语、波斯语、日语、韩语
了解更多