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The RF sputtering SiC target(MAT-CN)

SiC-t

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Description

SiC target 99.5%

Physical properties
Color Black
Density 3.22g/ml
Melting point 2730

Technical indicators
purity 99.5%
Relative density >99%
Cut surface flatness 3.2Ra
Tolerance ±0.1mm
grain size uniform
Material SiC
Brand MAT-CN
Origin Nanchang Jiangxi

Specifications
Size 01: diameter <360mm thickness> 1 mm (wafer / round table / rod)
Size 02: length <300mm width <300mm thickness> 1mm rectangular / sheet / step-like (splicing)
Size 03: outer diameter <360mm inner diameter> 1mm wall degree> 1 mm length> 1 mm (pipe / ring / rotatable targets)
Size 04 :: be customized according to user needs, sample processing, to map processing

Minimum order quantity
1, large concessions

Supply capacity
the same batch, the same material, continuous and reliable supply; 100 kg / month min

Delivery time
a single sheet of material 1 week delivery, bulk material 20 days -30 days delivery(working days)

Production process
vacuum levitation melting, casting into ingots, thermo-mechanical treatment and precision machining

Applicable instruments
various models magnetron sputtering equipment, etc.

Product uses
industrial-grade coating, experiments or research level SiC target, electronics, optoelectronics, military, decorative, functional film

Advantages quality
1. reliability, price
2.Vacuum melting, purification and preparation of high purity, less impurity
3.Dense, rolling, oxidation, forming plasticizers
4.relatively high density, grain uniformity axis, consistency

Product accessories
formal quotation / purchase and sales contracts / packing list / material analysis detection of single / formal invoice

Packing vacuum
packaging / vacuum neutral packing / special packaging outside reinforcement package

Mode of transport for
domestic express carrier (SF, Shen Tong, EMS, Nadu --- safe, fast and reliable)

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