Industrial & Specialty Packaging
Description
& quot;Advanced thermal management and embedded coin technology
High Performance and Emerging Materials; Halogen free,low loss,ultra-thin,mixed packages, inlay
Sequential Lamination
High Tech Drilling Capability – Small hole drilling, Backdrilling
Mechanical depth control drilling with +/-10um tolerance,min drill
size 0.15mm
Ultra Fine Pitch (0.8, 0.5, 0.4, 0.3 mm)
http://www.hemeixinpcb.com& quot;
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Hemeixin Electronics Co.,Ltd
applied in communication
Address: South of 5th Floor, Building 7,Wanxia Industrial Park, Tongfuyu Industrial Area, Shajing Town, Baoan District, Shenzhen,China,
shenzhen, guangdong
China,
Tel: 86-0755-27586529
Fax: 86-0755-27934435