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Mid Temperature Solder Paste Sn62Pb36Ag2

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Product DetailsMiddle and low temperature lead solder paste BBIEN TL-02 Sn62Pb36Ag2Brief IntroductionBBIEN solder paste manufacturer has enough technique to make tin-lead-silver Sn62Pb36Ag2 solder paste,which is an organic acid,water-soluble solder paste that provides users with the highest level of consistency and performance.Batch after batch,Sn62Pb36Ag2 provides hours of stable stencil life,tack time and repeatable brick defini-tion.Sn62Pb36Ag2’s robust printing characteristics result in consistent solder paste volume regardless of idle time,stencil life and print speed.The activator package in the Sn62Pb36Ag2 is very aggressive and provides superior wetting to OSP-coated PCB’s and Ag/Pd components.Sn62Pb36Ag2 Solder paste Melting informationSn62Pb36Ag2 has a melting point about 179°C to 183 degree,and has been successfully used with peak reflow profiles between 155°C and 190°C.Contained 2%silver,which make soldering point is brighter and very good soldering result.The outstanding batch consistency,anti-slump chemistry,consistent print volumes,solderability and cleanability make the Sn62Pb36Ag2 an ideal water-soluble solder paste for any application.Stable wetting behavior over a wide range of profilesAvailable type size of Sn62Pb36Ag2 solder pasteBBIEN supplies five types of solder paste for TL-02 Sn62Pb36Ag2 Pb no clean pasteType7(5~12micron)lead solder paste for ultrafine pitch printing technique.Type6(10~18micron)Sn-Pb-Ag solder paste/creamType5(15~25micron)no clean solder paste for leaded-SMD solderingType4(25~38micron)normal type of leaded solder paste for normal stencil and dispensing soldering.Type3(25~45)tin lean solder pasteAvailable packing infosmationThe Sn62Pb36Ag2 medium temperature lead solder paste could be classified as can/bottle packing and syringe packing type.Each jar/can/bottle holds the solder paste/cream is 500g;Each cartridge/syringe can load the solder paste/cream is 100gThe packing materials can be separated into inner layer of a bubble

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