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Power Bank Circuit Boards

06

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Description

Layer count
1-36 layers
Min line width/space
3mil/3mil
Mim Mechanical drilling hole size
Board thickness≤1.2mm 0.15mm
Board thickness≤2.5mm 0.2mm
Board thickness>1.2mm Aspect ratio≤15:1
Finished board thickness
Max: 10mm
Min: 2 layers-0.2mm; 4 layers-0.35mm; 6 layers-0.55mm;
8layers-0.7mm, 10layers-0.9mm
Finished copper thiciness
Inner layer/outer layer:6oz/10oz
Max panel size
610*1200mm
Impedeance Tolerance
±10%
Min Dielectric thickness
2mil
Type of dielectric meterial
FR4,high TG,Flex,rigid,rigid-flex, Halogen Free material,Aluminum based material,Copper based material,High frequency material,PTFE material,heavy copperfoil,paperphenolic plate,BT,PI,Composite material,PTFE+ metal based
Major Material supplier
FR4:Shengyi,ITEQ,Isola,KB,Arlon
PTFE:Rogers,Taconic,Nelco,Wangling,
Metal based meterial:Bergquist,Laird,Totking,ITEQ,Arlon,

Soldermask colour
green,red,blue,white,black,yellow
Surface treatment
HASL ,immsersion gold,immersion silver,OSP,gold finger

Special process
Multilayer PCB with blind or buried vias, impedance control
Quality control
AOI,100% electronic test

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